Side-key capacitive fingerprint sensor
Ultra-thin in-display fingerprint sensor
Lens-type in-display fingerprint sensor
Chip-scale in-display fingerprint solution
Side-key capacitive fingerprint sensor
Ultra-thin in-display fingerprint sensor
Lens-type in-display fingerprint sensor
Chip-scale in-display fingerprint solution
Side-key Capacitive
fingerprint sensor
JV 0101
Our capacitive fingerprint sensor adopts ultra-narrow design, allowing it to serve as a side-key integrated power/fingerprint button, making the phone beautiful in design while providing an optimized touch experience.
- 2.1mm width ultra-narrow LGA
- Few peripheral components, compact structure
- Good performance and security using the JFinger algorithm
Ultra-thin In-display
fingerprint sensor
JV 0201
Our ultra-thin in-display fingerprint sensor adopts advanced pixel technology for enhanced sensitivity. The product uses micro lens optical collimation system and features high signal-to-noise ratio (SNR) and thinness. Simplifying device architectural design, this solution offers consumers an optimized unlocking experience.
- High-sensitivity pixel design
- High SNR ultra-thin optical system
- Advanced 12" wafer process
Lens-type In-display
fingerprint sensor
JV 0301
The JV0301 lens-type in-display fingerprint sensor uses an advanced BSI pixel technology which offers advantages including high sensitivity and SNR. Its unique circuit design and algorithm make for speedy, high precision unlocking. Hence, it delivers improved user experience.
- BSI pixel technology
- High SNR
- High sensitivity
- Fast unlocking
JV 0302
The JV0302 lens-type in-display fingerprint sensor uses an advanced BSI pixel technology which offers advantages including high sensitivity and SNR. Its unique circuit design and algorithm make for speedy, high precision unlocking. Hence, it delivers improved user experience.
- Good performance and cost effectiveness
- High SNR
- Fast unlocking
Chip-scale In-display
fingerprint solution
JV 0401
Our original design JV0401 chip-scale in-display fingerprint solution uses a wafer-level optical process. Its ultra-small all-in-one design reduces space by 70% compared to traditional lens-type fingerprint sensor, leaving more space for device design. It uses the mature, stable SMT assembly process.
- Ultra-small chip-scale module
- 70% lower space usage than traditional lens-type fingerprint solution
- SMT assembly process
- Standardized components reduce inventory
